4N Nickel Ni Target

Produkt-Beschreibung

Overview

4N Nickel Ni Target is a high-purity nickel-based sputtering target material. Its core advantages lie in its uniform metal structure, excellent thermal and electrical conductivity, and chemical stability. It can be used in the semiconductor and magnetic recording industries, as well as in high-end functional coating applications, providing stable support for fields with stringent requirements for thin film performance.

Nickel Features

• Nickel has a high thermal conductivity, and while significant heat is generated during sputtering, its excellent thermal conductivity prevents localized overheating and cracking in the target.
• High and stable electrical conductivity ensures efficient sputtering power transmission and reduces energy loss.
• High-purity nickel has a uniform metallic structure, enabling stable particle release during sputtering, ensuring the quality and precision of deposited films.
• Nickel is not easily oxidized or reacts with other gases in a vacuum environment, reducing the introduction of impurities during sputtering and ensuring film purity.
• Nickel has excellent ductility and plasticity, allowing it to be processed into targets of varying sizes and thicknesses through forging, rolling, and cutting, adapting to the chamber structures of various sputtering equipment.

4N Nickel Ni Target Dimension

Application

1. Semiconductor Industry

• Semiconductors are one of the core applications of 4N Nickel Ni Target, primarily leveraging their high purity and sputtering stability to ensure the precision and reliability of chip circuits. In integrated circuits and power semiconductors, nickel targets are used to deposit metal electrode layers, enabling current transmission within the chip. High purity prevents impurities from affecting circuit performance.
• Nickel thin films act as a barrier, preventing copper atoms from diffusing into the chip's insulating layer, thereby preventing circuit shorts and performance degradation.

2. Magnetic Recording Industry

• Nickel possesses certain magnetic properties, and its stable magnetic permeability after sputtering makes it a key target material in the magnetic recording industry, directly impacting the capacity and read/write speed of storage devices. Nickel targets are used to deposit magnetic functional layers in hard drive heads, magnetic storage films, as well as in magnetic tapes and magnetic cards, improving storage density and data read/write accuracy.
• In magnetic sensors (such as automotive ABS sensors and industrial position sensors), nickel-based thin films serve as magnetic sensing layers, enhancing sensor sensitivity and stability.

3. Decorative and Functional Coatings

• Target sputtering creates a glossy decorative layer on the surfaces of stainless steel tableware, lamps, hardware accessories, and automotive interiors, while also improving surface wear resistance and preventing scratches and oxidation from daily use.
• Depositing nickel-based thin films on glass and metal surfaces enhances corrosion resistance and UV aging resistance, extending product life.

4. New Energy and Other Fields

• Nickel thin films can be used as conductive enhancement layers or corrosion-resistant coatings on the current collectors of lithium-ion and solid-state batteries, improving battery charge and discharge efficiency and cycle life.
• In electrode coatings for some photovoltaic modules, as well as in optical thin films such as infrared reflective films and privacy films, nickel targets can serve as auxiliary functional layers to optimize the performance of optoelectronic devices.

Process

① Chemical purification is used to initially remove impurities, followed by ultra-purification through vacuum electron beam melting to ensure nickel purity reaches 4N grade.

② The melted nickel ingot is cast in a vacuum environment, and hot isostatic pressing is used to eliminate internal porosity and ensure target density.

③ The nickel ingot undergoes multiple rolling or forging passes to achieve the desired thickness and grain structure, with vacuum annealing performed in between to eliminate work hardening.

④ The target blank is cut using ultra-precision wire cutting or laser cutting, with dimensional tolerances controlled within ±0.5mm.

⑤ Chemical mechanical polishing is used to reduce surface roughness and meet the requirements for high-uniform sputtering.

⑥ Rigorous quality inspections are performed, including purity analysis, performance testing, and non-destructive testing.

Other Alloy Target

4N Nickel Ni Target  Pictures